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Electronics & Manufacturing

ICEPT 2026 INTERNATIONAL CONFERENCE ELECTRONIC PACKAGING TECHNOLOGY

This exhibition has already taken place.

Dates
Venue and location
Beijing National Convention Center, Beijing, ChinaBeijing National Convention Center, Chaoyang District, Beijing
More exhibitions in BeijingExhibitions in China
ICEPT 2026 INTERNATIONAL CONFERENCE ELECTRONIC PACKAGING TECHNOLOGY — Beijing, China

About this exhibition

ICEPT is the world's leading conference on electronic packaging and interconnection technology. Featuring 500+ technical papers and attracting 38,000+ engineers and researchers, it drives semiconductor packaging innovation.

Exhibitor profile

Semiconductor manufacturers, packaging equipment suppliers, test companies, materials providers, research labs

Visitor profile

40000

About the organiser

Beijing National Convention Centre specializes in technology and engineering research conferences.

Speakers

Prof. Zhang Ming, Dr. James Wilson, Ms. Li Xia, Prof. Robert Lee

Sessions

Semiconductor Packaging, Thermal Management, Interconnection Technology, Materials Science, Quality Control

Sponsors

Intel, Samsung Electronics, TSMC, Qualcomm, NXP Semiconductors

Partners

Tsinghua University, Chinese Academy of Sciences, IEEE Electronics Packaging Society

Contact the organiser

Ask about ICEPT 2026 INTERNATIONAL CONFERENCE ELECTRONIC PACKAGING TECHNOLOGY — stands, pricing, availability, or anything else. Your message goes straight to their inbox.

  • Their email address stays private.
  • They reply to you directly by email.

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